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MillPack offers engineering consulting and CAD/CAM services for layout of printed circuit boards, multi-chip modules, hybrids and custom semiconductor packaging.

 

• Schematic capture, PCB design and mechanical drafting

• RoHS & Lead-free compliant

• Auto-routing & Hand-routing

• Matched length, differential & controlled impedance

Simulation - Signal integrity and thermal management

• High-speed, mixed signal and RF/microwave circuits

High power circuits

 

We work with a wide range of substrate materials and microelectronic packaging options such as, but not limited to:

 

FR4 printed circuits, Flex and rigid-flex, Polyimide, BT

Alumina, Aluminum Nitride, Beryllium Oxide

Thick-films and Thin-films including DuPont™ Fodel®

Low Temperature Co-fired Ceramics (LTCC)

Hybrids and Multi-Chip Modules

Flip-chip and wire-bond attachments

Chip-scale packaging and stacked-chip packaging

Chip carriers and semiconductor packaging

Ball grid arrays (BGA) and pin grid arrays (PGA)

Kovar® metal housings with glass feedthrus

• Subtrates with Kovar® ring and seal lid, brazed pins, cavities and lead frames, embedded capacitors, inductors and printed resistors

 

Software

 

We have selected a handful of packages that are capable of delivering fast and precise results.

 

PADS    AutoCAD    CAM350    Signal integrity toolsSignal integrity tools

 

Integration

 

Our experienced engineering partnered with ISO 9001:2008 certified manufacturers provide the best integration design/manufacturing.

 

We believe real-time interface between customer, designer and manufacturer is imperative.

 

Documentation

 

Input - We accept inputs in a variety of electronic formats, even hand written to convert into reliable CAD data. We stay in touch throughout the entire project cycle to ensure customers are up-to-date and comfortable with our progress, so we deliver what they expect and when they expect.

 

Output - In addition to Gerber, IPC netlists and assembly pick-and-place files, we will provide documentation drawings and check plots in Adobe® PDF format and DXF/AutoCAD® for easy viewing and printing.

 

Backup & Security - Every document is electronic or converted to electronic. Files are kept organized in folders by customer, date, project name and purchase order. We encrypt using DoD encryption standards and double backup off-site and online.

 

 

 

 

LTCC, multi-chip module



    Ceramic Pin Grid Array, multi-chip carrier


    Thick-film multi-chip module on Alumina


    Organic Ball Grid Array, single chip carrier

  
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